所属学院：

先进制造学院

导师类别：

硕士生导师

科研方向：

1、电子封装高性能材料制备与加工；

2、高能束表面加工与增材制造；

3、材料表面改性与修复；

4、材料失效分析与性能检测。

联系方式：

linlideyu@126.com

招生学院：

材料与能源学院

个人简述

 全国大学生金相技能大赛组委会副主任委员， 江苏省“六大人才高峰”人才项目资助对象，苏州市“紧缺人才”计划资助对象。主持国家自然科学基金项目、省自然科学基金项目、省科技支撑项目、省产学前瞻项目10余项，校企合作项目10余项。在研国家自然基金2项，“3D封装In基焊点金属间化合物生长行为控制及空洞抑制机理研究”和“纳米In-Sn复合钎料3D封装焊点物相组配调控及高温损伤机理研究”。在研省基金1项，“InSn基3D封装焊点相结构调控及热损伤机理研究”。获省部级科技进步奖6项，其中2019年获河南省科学技术进步奖二等奖1项，发表SCI论文80余篇，获授权发明专利10件。。

学科领域

科学学位：材料科学与工程

专业学位：材料工程

教育背景

2010年9月-2013年12月  在中国矿业大学  矿物材料加工专业   获博士学位

2000年9月-2004年6月   在华中科技大学  机械工程专业       获硕士学位

1985年9月-1989年6月   在西安交通大学  焊接工艺与设备专业 获学士学位

工作经历

2021年08月–至今          广东工业大学  先进制造学院  教授

2019年10月–2021年07月  桂林航天工业学院  科技处 教授   学科办主任

2011年09月–2019年10月  常熟理工学院  教授  机械工程学院副院长/学科建设与研究生教育处副处长

2005年09月–2011年08月  华北水利水电大学  机械学院 教授

1996年04月–2005年08月  中原工学院  机械学院  副教授

学术兼职

全国大学生金相技能大赛副主任委员

江苏省机械工程学会焊接专业委员会常务理事  

苏州市焊接学会副理事长

广西本科高等学校材料类教学指导委员会委员

主要荣誉

[1]2019年“钎缝缺陷产生诱因及防控技术”获2019年度河南省科技进步奖二等奖，第二。

[2]2019年“高性能颗粒增强Sn基复合钎料研发与应用”获2019年度江苏机械工业学会绿色制造科技进步奖一等奖，第一。

[3]2017年“新型高可靠性SnBi复合钎料的开发与应用”获2017年度江苏机械工业协会科技进步奖一等奖，第一。

[4]2017年参与项目“新型高可靠性SnBi复合钎料的开发与应用”获2017年度苏州市科技进步奖三等奖，第一。

[5]2013年获江苏省“六大高峰人才”称号。

主要论文

[1]Li   Yang, W. Lu, Z. Liu, et al. Location-Dependent Microstructure and Properties   for Plasma Arc Additively Manufactured Duplex Stainless Steel ER2209 Wire.   Journal of Materials Engineering and Performance, 2021:1-13.

[2]Li   Yang, Y. Xu, Y. Zhang, et al. Effect of bonding time on the microstructure   and shear property of Cu/SAC-15Ag/Cu 3D package solder joint fabricated by   TLP. Journal of Materials Science: Materials in Electronics, 2021.

[3]Li   Yang, J. Qiao, et al. Effects of rare earth Ce addition on the microstructure   and shear property of Cu/In-50Ag/Cu composite solder joint. Microelectronics   Reliability, 2021.

[4]Li   Yang, Lu Zhu, Yaocheng Zhang, Shiyuan Zhou, Guoqiang Wang, Sai Shen, Xiaolong   Shi, Microstructure, IMCs layer and reliability of Sn-58Bi solder joint   reinforced by Mo nanoparticles during thermal cycling, Materials   Characterization, https:// doi.org/10.1016/j.matchar.2018.12.012

[5]Li   Yang, Yaocheng Zhang, Jun Dai, Yanfeng Jing, Jinguo Ge, Ning Zhang.   Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl   (x=0–0.075) lead-free solder alloy. Materials and Design, 2015, 67: 209-216.

[6]Li   Yang Yifeng Xiong, Yaocheng Zhang, Wei Jiang, Di Wei. Microstructure and   shear property of In‑Sn‑xAg solder joints   fabricated by TLP bonding. Journal of Materials Science: Materials in   Electronics. 2019,30:18211–18219.

[7]Li   Yang, Gangang Wang, Yifeng Xiong, Sai Shen, Yaocheng Zhang. Investigation of   Cu particles size and bonding time on the microstructure and shear property   of Cu/In-45Cu/Cu solder joints. Materials Research Express,2020,7,1:   2473-2478 

[8]Li   Yang Yifeng Xiong, Yaocheng Zhang. Effect of Pb content on microstructure and   mechanical properties of Al-Pb surface composites by friction stir   processing. Materials Research Express,2020,6,8: 6028-6036 

[9]Li   Yang Shiyuan Zhou, Yaocheng Zhang,Lu Zhu,Yifeng Xiong. Reinforcement of   vanadium on the microstructure and properties of Sn-58Bi lead-free solder   joints. Materials Research Express,2019,6,17: 4180-4185

[10]Li   Yang,Yao Yang ,Yaocheng Zhang, Feng Xu ,Jian Qiao,Wangzhang Lu ,Banglong Yu.   Microstructure evolution and mechanical properties of the In–Sn–20Cu   composite particles TLP bonding solder joints. Applied Physics A -Materials   Science&Processing,2020,9,16

[11]Li   Yang, Di Wei, Yaocheng Zhang, et al, Effect of aging temperature on   microstructure and mechanical properties of Sn-9Zn-xZrC solder joints,   Journal of Materials Science: Materials in Electronics,   https://doi.org/10.1007/s10854-018-0344-y

[12]Li   Yang, Lu Zhu, Yaocheng Zhang, et al, Microstructural evolution and IMCs   growth behavior of Sn-58Bi-0.25Mo solder joint during aging treatment,   Materials Research Express, 2018, 5(2):1-10

[13]Yaocheng   Zhang, Li Yang, Jun Dai, et al, Microstructure and mechanical properties of   pulsed laser cladded IN718 alloy coating, Surface Engineering, 2018,   34(4):259-266

[14]Li   Yang, Bingbing Song, Yaocheng Zhang, et al, Microstructure, interfacial IMC   layer and mechanical properties of Cu/Sn-9Zn-xZrC/Cu solder joints, Materials   Research Express, 2018, 5(8)

[15]Li   Yang, Lu Zhu, Yaocheng Zhang, Po Liu, et al, Microstructure and reliability   of Mo nanoparticle reinforced Sn-58Bi-based lead-free solder joints,   Materials Science and Technology, 2017, 34(8):1-11

[16]Li   Yang, Haixiang Liu, Yaocheng Zhang. Study on the Tensile Creep Behavior of   Carbon Nanotubes-Reinforced Sn-58Bi Solder Joints, Journal of Electronic   Materials 2018, 47(1), 662–671

[17]Li   Yang, H. Liu, Y. Zhang, H. Yu. Study on the Reliability of Carbon   Nanotube-Reinforced Sn-58Bi Lead-Free Solder Joints, Journal of Materials   Engineering and Performance, 2017, 26(12): 6028-6036.

[18]Li   Yang, Jinguo Ge, Yaocheng Zhang, Jun Dai. Interfacial IMC Layer and Tensile   Properties of Ni-Reinforced Cu/Sn–0.7Cu–0.05Ni/Cu Solder Joint: Effect of   Aging Temperature. Transactions of the Indian Institute of Metals, 2017,   9(70):2429-2439.

[19]Li   Yang, Jinguo Ge, Yaocheng Zhang, Jun Dai, Yanfeng Jing. Electromigration   reliability for Al2O3-reinforced Cu/Sn–58Bi/Cu composite solder joints.   Journal of Materials Science: Materials in Electronics, 2017,   3(22):3004-3012.

[20]Li   Yang, JINGUO GE, YAOCHENG ZHANG, JUN DAI, HAIXIANG LIU, JICEN XIANG.   Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical   Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints. Journal of Electronics   Materials, 2016, 7(45): 3766-3775.

[21]Li   Yang, Jing Ge, Haixiang Liu, Liufeng Xu, Anbing Bo. Effect of Cooling Rate on   the Microstructure and Mechanical Properties of Sn-1.0Ag-0.5Cu–0.2BaTiO3   Composite Solder. Journal of Electronic Materials, 2015, 11(44): 4595-4603.

[22]Li   Yang, Jinguo Ge, Yaocheng Zhang, Jun Dai, Yanfeng Jing. Effect of BaTiO3 on   the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free   solder. Journal of Materials Science: Materials in Electronics, 2015,   26:613-619.

[23]Li   Yang; Jun Dai; Yaocheng Zhang. Influence   of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties   of Sn-58Bi Solder. Journal of Electronic Materials, 2015, 44(7): 2473-2478.

[24]Li   Yang; Chengchao Du; Ning Zhang; Jun Dai; Jinguo Ge; Y. Jing. G. Wang.   Modification of Sn58Bi solder based on graphite. Materials Science and   Technology, 2014, 30(7): 806-811.

[25]Li   Yang, Yaocheng Zhang, Chengchao Du, Jun Dai, Ning Zhang. Effect of aluminum   concentration on the microstructure and mechanical properties of Sn-Cu-Al   solder alloy, Microelectronics Reliability, 2015, 55(3–4): 596–601.

[26]Li   Yang, Chengchao Du, Jun Dai, Ning Zhang, Yanfeng Jing. Effect of nanosized   graphite on properties of Sn–Bi solder. Journal of Materials Science:   Materials in Electronics, 2013, 24: 4180-4185.

[27]Li   Yang. Effect of Ag particles content on properties of Sn0.7Cu solder. Journal   of Materials Science: Materials in Electronics, 2013, 24: 1405-1409.

[28]Li   Yang; Jun Dai; Lili Li; G L Guo; L Z Guo; G L Zhao. Precipitate morphology   and effects on strength of laser welded Mg-Nd-Zn-Zr after aging treatment.   Materials Science and Technology, 2013, 29(12): 1478-1483.

[29]Y.   Zhang, L. Yang*, J. Dai, J. Liu, W. Zhang, H. Chen, Z. Wang, K. Shi.   Microstructure and mechanical properties of pulsed laser cladded IN718 alloy   coating, Surface Engineering, 2018, 34(4): 259-266.

[30]Y.   Zhang, L. Yang*, T. Chen, W. Zhang, X. Huang, J. Dai. Investigation on the   optimized heat treatment procedure for laser fabricated IN718 alloy, Optics   & Laser Technology, 2017, 97: 172-179.

[31]Y.   Zhang, L. Yang*, T. Chen, S. Pang, W. Zhang. Sensitivity of Liquation   Cracking to Deposition Parameters and Residual Stresses in Laser Deposited   IN718 Alloy, Journal of Materials Engineering and Performance, 2017, 26(11):   5519-5529.

[32]Y.   Zhang, Q. Pan, L. Yang*, R. Li, J. Dai. Tribological Behavior of IN718   Superalloy Coating Fabricated by Laser Additive Manufacturing, Lasers in   Manufacturing and Materials Processing, 2017, 4(4): 153-167.

[33]Y.   Zhang, L. Yang*, J. Dai, Z. Huang, and T. Meng. Grain growth of Ni-based   superalloy IN718 coating fabricated by pulsed laser deposition. Optics &   Laser Technology, 2016, 80, 220-226.

[34]Yaocheng   Zhang; Li Yang*; Zedong Huang; Jun Dai. Study on the Indentation Creep   Behavior of Mg-4Al-RE-0.8Ca Magnesium Alloy. Journal of Materials Engineering   and Performance, 2015, 24(11):4290-4296

[35]Yaocheng   Zhang, Li Yang*, Jun Dai, Guolin Guo, Zhong Liu. Effect of Ca and Sr on   microstructure and compressive creep property of Mg-4Al-RE alloys, Materials   Science and Engineering A, 2014, 610: 309–314

[36]Yaocheng   Zhang, Li Yang*, Jun Dai, Guolin Guo, Zhong Liu. Effect of Ca and Sr on the   compressive creep behavior of Mg–4Al–RE based magnesium alloys, Materials and   Design, 2014, 63: 439–445

[37]Dai   Jun, Yang, Li*, Zhang Yaocheng. Research on pulsed laser welding of   TiB2-enhanced aluminum matrix composites, International Journal of Advanced   Manufacturing Technology, 2016, 85(1-4):157-162

[38]Dai   Jun，Wang Xinxing, Yang Li*, Huang   Jian, Zhang Yaocheng, Chen Jian. Study of plasma in laser welding of   magnesium alloy, International Journal of Advanced Manufacturing Technology,   2014, 73(1-4):443-447

[39]Li   Yang*, Gangang Wang, Yifeng Xiong, et al, Investigation of Cu particles size   and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu   solder joints. Materials Research Express,2020,7(1): 2473-2478.

[40]Yang   L*, Qiao J, Zhang Y C, et al. Effect of Bonding Time on Microstructure and   Shear Property of Cu/In-50Ag/Cu TLP Solder Joints. Journal of Electronic   Materials, 2020. 49:4300–4306

[41]Li   Yang*, Yao Yang, Yaocheng Zhang, et al, Microstructure evolution and   mechanical properties of the In–Sn–20Cu composite particles TLP bonding   solder joints. Applied Physics A -Materials Science&Processing,2020,9(16)

[42]Li   Yang, Wangzhang Lu, Yaocheng Zhang, et al. Microstructure evolution, fracture   mechanism and constitutive analysis of spray–formed and extruded   Al–12Zn–2.4Mg–1.1Cu–0.3Zr alloy, Journal of Materials Engineering and   Performance, 2020,29(12), 8306-8318.

[43]Yaocheng   Zhang, Li Yang*, Wangzhang Lu, et al. Microstructure and elevated temperature   mechanical properties of IN718 alloy fabricated by laser metal deposition,   Materials Science and Engineering: A, 2020, 771(Jan.13): 138580.1-138580.11.

知识产权

[1] 含纳米石墨的SnBi系低温无铅钎料膏. ZL:   201310316392.8

[2] 软钎料合金蠕变性能的测试方法和该方法所用的测试装置. ZL: 201310316434.8

[3] 超重力环境下的熔化极气体保护焊焊接装置. ZL:201410142652.9

[4] 金属试样带电拉伸试验用的夹具结构. ZL:201420166675.9

[5] Mg-Gr-Y稀土镁合金的激光焊接方法. ZL: 201310206014.4

[6] 镁合金板焊接用的夹具结构. ZL: 201310205997.X

[7] 激光焊接镁合金板用的夹具结构. ZL: 201320301979.7

[8]一种In-Ni体系钎料及其制备方法.    ZL:201910534201.2

[9] 一种铟基钎料及其制备方法. ZL:201910519447.2

[10]一种可同时加热冷却的钎料装置.ZL:202121914950.7

[11]一种钎料膏和粉末混合装置.ZL:202121898179.1

科研项目

[1]纳米In-Sn复合钎料3D封装焊点物相组配调控及高温损伤机理研究，国家自然科学基金，2022.01至2025.12，主持，在研

[2]3D封装In基焊点金属间化合物生长行为控制及空洞抑制机理研究，国家自然科学基金，2019.01至2022.12，主持，在研

[3]InSn基3D封装焊点相结构调控及热损伤机理研究，广西自然科学基金项目（面上项目），2021.01至2023.12，主持，在研

[4] 封装焊点的界面力学与界面形态控制的关键技术研究, 江苏省自然科学基金（面上项目），2014.07至2017.06，主持，结项，。

[5] 激光增材制造镍基高温合金裂纹萌生演变机制及敏感性因素研究，国家自然科学基金，2015.01至2017.12，第二，结项。

[6] 增强体对多场耦合下复合钎料焊点蠕变损伤的影响机理研究，国家自然科学基金,2016.01至2018.12，主持，结项。

[7] 高能束增材制造镍基合金高温稳定性评价及热裂纹控制，江苏省高校自然科学研究重大项目A类，2018.9-2021.8，第二，结项。

[8]超薄磨耗粘结层同步摊铺技术与设备的开发研究,江苏省科技支撑计划项目，2011.9-2014.8，主持，结项。

[9]稀土废渣治理再利用加工技术及成套装备研究，江苏省产学研前瞻联合研究项目，2015.9-2018.8，主持，结项。

[10]多场耦合下基于原位观察的焊点界面化合物生长行为研究，江苏省“六大人才高峰”项目，2013.8至2016.8，主持，结项。

[11]新型无铅基复合钎料研究，江苏省高校自然科学研究项目,2010.9-2013.9，主持，结项。

[12]焊接材料与工艺对p91和p22钢接头的性能影响分析，苏州热工研究院有限公司，2018.1-2018.7，主持，结项

[13]HC300LAD支撑槽成形工艺与DC06力学性能及生产工艺优化，烨辉中国材料科技有限公司，2017.12-2018.12，主持，结项

[14]23MnNiMoCr54矿用链钢机械性能改善，中天钢铁有限公司,2018.9-2019.8，主持，结项

[15] 稀土废渣治理再利用加工工艺及关键性技术研究，中铝稀土（江苏）有限公司，2016.1-2017.12，主持，结项

[16] 转子材料焊接性试验及焊缝金属物理性能试验，苏州热工研究院有限公司，2017.1-2018.1，结项

[17] 双相钢热处理工艺及力学性能的优化，烨辉中国材料科技有限公司，2019.12-2020.12，主持，结项

[18] 30CrMnTi短流程热处理工艺优化，江阴一鸣管业科技有限公司，2019.7-2020.7，主持，结项

[19] 动态运转下深沟球轴承CAE分析与保持架优化，常熟长城轴承厂，2019.7-2020.7，主持，结项

[20]千斤顶新材料研究及轻量化设计，常熟通润机械有限公司，2019.11-2020.11，主持，结项

[21]30CrMnTi短流程热处理工艺优化，江阴市一鸣管业有限公司，2020.4-2020.12，主持，结项