1、Bai, Zhenwei,Yan, Qiusheng,Lu, Jiabin,Xu, Xipeng,Parametric investigation into accommodate-sinking effect of cluster magnetorheological effect pad,International Journal of Advanced Manufacturing Technology,2014,75(9-12):1447-1456(SCI,SSCI收录)
2、Yan, Q. S.,Chen, S. K.,Pan, J. S.,Lu, J. B.,Liu, Q.,Surface and subsurface damage characteristics and material removal mechanism in 6H-SiC wafer grinding,Materials Research Innovations,2014,18:742-747(EI,SCI,SSCI收录)
3、路家斌,曾军,阎秋生,圆盘剪分切断面形貌形成机理研究,机械工程学报,2014,50(11):178-185(EI收录)
4、潘继生,阎秋生,路家斌,徐西鹏,陈森凯,集群磁流变平面抛光加工技术,机械工程学报,2014,50(1):205-212(EI收录)
5、阎秋生,赖志民,路家斌,李忠荣,欧阳杰,谢昭派,镀锌板圆盘剪分切侧向间隙对断面形貌的影响,塑性工程学报,2014,21(4):69-73
6、路家斌,李顺,阎秋生,谢昭派,欧阳杰,李忠荣,圆盘剪分切过程硬质合金圆盘刀磨损及其对分切质量的影响,塑性工程学报,2014,21(6):117-123
7、阎秋生,赵学明,路家斌,李忠荣,黄升伟,硬质合金圆盘刀分切硅钢片的磨损形态及机理研究,中国机械工程,2014,25(04):508-512
8、白振伟,阎秋生,路家斌,徐西鹏,集群磁流变效应抛光垫的磨粒“容没”效应机理研究,中国机械工程,2014,25(20):2705-2710
9、Wang Lei,阎秋生,Lu Jiabin,Xiao Xiaolan,Comparison of Fe catalyst species in chemical mechanical polishing based on Fenton reaction for SiC wafer,Advanced Materials Research,2014,1027:171-176(EI收录)
10、Bai Zhenwei,Yan Qiusheng,Lu Jiabin,Advanced Nano-finishing Process of SrTiO3 Substrate by Cluster MR-effect Plate,Materials Science Forum,2014,770:150-154(EI,ISTP收录)
11、路家斌,潘嘉强,阎秋生,不锈钢薄板圆盘剪分切过程有限元仿真研究,机械工程学报,2013,49(9):190-198(EI收录)
12、阎秋生,赖志民,路家斌,李忠荣,欧阳杰,金属板材无毛刺精密分切新工艺分切断面形貌特征,塑性工程学报,2013,20(2):20-24+39 |