杨冠南

作者: 时间:2021-03-25 点击数:

 

 

 

杨冠南,广东工业大学青年百人”A类人才,省部共建精密电子制造技术与装备国家重点实验室成员,本科-博士毕业于清华大学。从事微纳金属互连材料、先进微电子封装等领域的相关研究工作。主持国家自然科学基金及多个省部级科研项目。目前已在Ultrasonics Sonochemistry, ChemElectroChem, Journal of Materials Science and Technology, Applied Physics Letters, ICEPT, ECTC等相关领域著名国际期刊和国际会议上发表SCI论文48篇(一作/通讯35篇),EI论文16篇(通讯5篇),拥有中国授权专利40件(第一发明人28件)。另外,拥有美国授权专利1件和PCT专利7件。担任电子封装技术国际会议(ICEPT2020)分会主席,Metals国际期刊客座编辑,Materials LettersVacuumAdditive ManufacturingJournal of alloys and compounds等国际著名学术杂志审稿人。

 

教育与工作背景:

2018.7.–至今 广东工业大学 机电学院 青年百人计划”A类人才

2016.5.–2017.4 香港城市大学 助理研究员

2011.9.–2017.9 清华大学材料学院 博士

2007.9.–2011.6 清华大学机械工程系 本科

 

研究方向:

微电子封装材料、纳米金属材料、亚稳金属材料、电化学分析、激光加工等。

 

代表性SCI文章:

[1] G. Yang, W. Lin, H. Lai, J. Tong, J. Lei, M. Yuan, Y. Zhang, C. Cui, Understanding the relationship between particle size and ultrasonic treatment during the synthesis of metal nanoparticles, Ultrason Sonochem, 73 (2021) 105497.

[2] G. Yang, X. Zeng, P. Wang, C. Li, G. Xu, Z. Li, J. Luo, Y. Zhang, C. Cui, Size Refinement of Copper Nanoparticles: A Perspective from Electrochemical Nucleation and Growth Mechanism, Chemelectrochem, 8 (2021) 819–828.

[3] G. Yang, Q. Zou, P. Wang, H. Lai, T. Lai, X. Zeng, Z. Li, J. Luo, Y. Zhang, C. Cui, Towards understanding the facile synthesis of well-covered Cu-Ag core-shell nanoparticles from a complexing model, J Alloys Compd, 874 (2021) 159900.

[4] G. Yang, G. Xu, Q. Li, Y. Zeng, Y. Zhang, M. Hao, C. Cui, Understanding the sintering and heat dissipation behaviours of Cu nanoparticles during low-temperature selective laser sintering process on flexible substrates, J Phys D: Appl Phys, 54 (2021) 375304.

[5] G. Yang, H. Lai, W. Lin, J. Tong, J. Cao, J. Luo, Y. Zhang, C. Cui, A quantitative model to understand the microflow-controlled sintering mechanism of metal particles at nanometer to micron scale, Nanotechnology, 32 (2021) 505721.

[6] G. Yang, Z. Kuang, H. Lai, Y. Liu, R. Cui, J. Cao, Y. Zhang, C. Cui, A Quantitative Model to Understand the Effect of Gravity on the Warpage of Fan-Out Panel-Level Packaging, Ieee T Comp Pack Man, 11 (2021) 2022-2030.

[7] Y. Zhang, P. Cao, W. Lin, Q. Liu, Z. Chen, J. Cao, G. Yang*, C. Cui*, Synergy effect of mixed sintering accelerator on the deoxidation and sintering property improvement of Cu nanoparticles at low temperature, Appl. Phys. A-Mater. Sci. Process., 127 (2021) 783.

[8] Zhen Li, Baizhao Tan, Jiye Luo*, Jinfeng Qin, Guannan Yang*, Chengqiang Cui*, L. Pan, Structural Influence of Nitrogen-containing Groups on Triphenylmethane-based Levelers in Super-conformal Copper Electroplating, Electrochim Acta, 401 (2022) 139445.

[9] G.N. Yang, Y. Shao, C.T. Liu, K.F. Yao, How does the structural inhomogeneity influence the shear band behaviours of metallic glasses, Philos Mag, 100 (2020) 1663-1681.

[10] G. Yang, R. Qu, G. Xu, Q. Li, C. Cui, Z. Zhang, Understanding the tensile fracture of deeply-notched metallic glasses, Int J Solids Struct, 207 (2020) 70–81.

[11] G.N. Yang, K.F. Yao, Understanding the Fracture Behaviors of Metallic Glasses—An Overview, Appl Sci-Basel, 9 (2019) 4277.

[12] J.L. Gu, G.N. Yang, P. Gong, Y. Shao, K.F. Yao, Cryogenic charpy impact toughness of (Ti41Zr25Be26Ni8)(93)Cu7 bulk metallic glass, Mater Sci Eng A, 786 (2020) 139442.

[13] Y.S. Su, S.X. Li, G.N. Yang, F. Yu, Y.G. Wang, Shear instability and considerably localized melting in quasi-static compression, Mater Charact, 160 (2019) 110081.

[14] Jinfeng Li, Shuo Xiang, Hengwei Luan, Abdukadir Amar, Xue Liu, Siyuan Lu, Yangyang Zeng, Guomin Le, Xiaoying Wang, Fengsheng Qu, Chunli Jiang, Guannan Yang, Additive manufacturing of high-strength CrMnFeCoNi high-entropy alloys-based composites with WC addition, J Mater Sci Technol, 35 (2019) 2430-2434.

[15] Xuerun Zhang, Rui Li, Liufei Huang, Abdukadir Amar, Changgui Wu, Guomin Le, Xue Liu, Denggao Guan, Guannan Yang, J. Li, Influence of in-situ and ex-situ precipitations on microstructure and mechanical properties of additive manufacturing CoCrFeMnNi high-entropy alloys, Vacuum, 187 (2021) 110111.

[16] Z. Li, B. Tan, M. Shi, J. Luo, Z. Hao, J. He, G. Yang, C. Cui, Bis-(sodium sulfoethyl)-disulfide: A Promising Accelerator for Super-conformal Copper Electrodeposition with Wide Operating Concentration Ranges, J Electrochem Soc, 167 (2020) 042508.

[17] Yang G N, Li Z, Guo F M, Luo Y, Han Z D, Lu Z C, Wei J Q, Shao Y, Yao K F, Size-effect in Pd77.5Cu6Si16.5 metallic glass micro-wires: more scattered strength with decreasing diameter, Appl Phys Lett. 2017, 111:011905. (SCI, IDS number: AT5RQ, impact factor: 3.411, ISSN: 0003-6951, 中科院分区:2)

[18] Luo Y, Yang G N*, Shao Y, Yao K F, The effect of void defects on the shear band nucleation of metallic glasses, Intermetallics, 2018, 94: 114-118. (SCI, IDS number: CH0WZ, impact factor: 3.140, ISSN: 0966-9795, 中科院分区:2)

[19] Yang G N, Shao Y, Yao K F, The material-dependence of plasticity in metallic glasses: An origin from shear band thermology, Mater Des, 2016, 96:189–194. (SCI, IDS number: DF4CX, impact factor: 4.364, ISSN: 0264-1275, 中科院分区:2)

[20] Yang G N, Sun B A, Chen S Q, Shao Y, Yao K F, The multiple shear bands and plasticity in metallic glasses: A possible origin from stress redistribution, J Alloys Compd, 2017, 695:3457-3466. (SCI, IDS number: EH5MV, impact factor: 3.133, ISSN: 0925-8388, 中科院分区:2)

[21] Yang G N, Sun B A, Chen S Q, Gu J L, Shao Y, Wang H, Yao K F, Understanding the effects of Poisson’s ratio on the shear band behavior and plasticity of metallic glasses, J  Mater  Sci, 2017, 52:6789-6799. (SCI, IDS number: AM6HD, impact factor: 2.599, ISSN: 0022-2461, 中科院分区:2)

[22] Yang G N, Gu J L, Chen S Q, Shao Y, Wang H, Yao K F, Serration Behavior of a Zr-Based Metallic Glass Under Different Constrained Loading Conditions, Metall Mater Trans A, 2016, 47:5395-5400. (SCI, IDS number: DY3VH, impact factor: 1.874, ISSN: 1073-5623, 中科院分区:2)

[23] Yang G N, Shao Y, Yao K F, The shear band controlled deformation in metallic glass: a perspective from fracture, Sci Rep, 2016, 6:21852. (SCI, IDS number: DE3GT, impact factor: 4.259, ISSN: 2045-2322, 中科院分区:3)

[24] Yang G N, Shao Y, Yao K F, A non-viscous-featured fractograph in metallic glasses, Philos Mag, 2016, 96:542-550. (SCI, IDS number: DG5EG, impact factor: 1.505, ISSN: 1478-6435, 中科院分区:3)

[25] Yang G N, Chen S Q, Gu J L, Zhao S F, Li J F, Shao Y, Wang H, Yao K F, Serration behaviours in metallic glasses with different plasticity, Philos Mag, 2016, 96:2243–2255. (SCI, IDS number: DG5EG, impact factor: 1.505, ISSN: 1478-6435, 中科院分区:3)

[26] Yang G N, Shao Y, Yao K F, Chen S Q, A study of cooling process in bulk metallic glasses fabrication, Aip Advances, 2015, 5:117111. (SCI, IDS number: CX9WB, impact factor: 1.568, ISSN: 2158-3226, 中科院分区:3)

[27] Chen S Q, Yang G N, Luo S T, Yin S J, Jia J L, Li Z, Gao S H, Yao K F, Shao Y, Unexpected high performance of Fe-based nanocrystallized ribbons for azo dye decomposition, Journal of Materials Chemistry A. 2017 , 5 (27) (SCI, IDS number: EV7BU, impact factor: 8.867, ISSN: 0264-1275, 中科院分区:1)

[28] Shao Y, Yang G N, Yao K F, Liu X, Direct experimental evidence of nano-voids formation and coalescence within shear bands, Appl Phys Lett, 2014, 105:181909. (SCI, IDS number: AT5RQ, impact factor: 3.411, ISSN: 0003-6951, 中科院分区:2)

[29] Shao Y, Yang G N, Yao K F, Nanocrystalline Phase Formation inside Shear Bands of Pd-Cu-Si Metallic Glass, Adv Mater Sci Eng, 2014, 2014:490181. (SCI, IDS number: AH6VY, impact factor: 1.299, ISSN: 1687-8434, 中科院分区:2)

[30] Zhao S F, Yang G N, Ding H Y, Yao K F, A quinary Ti-Zr-Hf-Be-Cu high entropy bulk metallic glass with a critical size of 12 mm, Intermetallics, 2015, 61:47-50. (SCI, IDS number: CH0WZ, impact factor: 3.140, ISSN: 0966-9795, 中科院分区:2)

[31] Li J F, Wang X, Yang G N, Chen N, Liu X, Yao K F, Enhanced plasticity of a Fe-based bulk amorphous alloy by thin Ni coating, Mater Sci Eng A, 2015, 645:318-322. (SCI, IDS number: CR8DS, impact factor: 3.094, ISSN: 0921-5093, 中科院分区:2)

[32] Ding H Y, Li Y, Yang G N, Yao K F, Qiu S B, The Effect of Purification on the Glass-Forming Ability of a Pd-Cu-Si Alloy, Metall Mater Trans A, 2012, 43A:2610-2614. (SCI, IDS number: 964YO, impact factor: 1.874, ISSN: 1073-5623, 中科院分区:2)

[33] Han Z D, Chen N, Zhao S F, Fan L W, Yang G N, Shao Y, Yao K F, Effect of Ti additions on mechanical properties of NbMoTaW and VNbMoTaW refractory high entropy alloys, Intermetallics, 2017, 84:153-157. (SCI, IDS number: CH0WZ, impact factor: 3.140, ISSN: 0966-9795, 中科院分区:2)

[34] Liu X, Chen N, Gu J L, Yang G N, Mussler G, Yao K F, Die imprinting of MGs: A One-step Approach for Large-area Metallic Photonic Crystals, Mater Des, 2015, 87: 1018-1021. (SCI, IDS number: DF4CX, impact factor: 4.364, ISSN: 0264-1275, 中科院分区:2)

[35] J. Cao, J. Zhang, B. Wu, H. Tang, C. Lv, K. Song, G. Yang, C. Cui, Y. Gao, Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire, Micromachines, 12 (2021) 938.

 

授权专利:

[1] 杨冠南、匡自亮、徐广东、崔成强、张昱、张凯,一种微小物体的定向移动方法,ZL201910168114.X,授权,2021-05-11

[2] 杨冠南、罗绍根、崔成强、张昱,一种抑制芯片漂移与翘曲的封装方法,ZL202010148694.9,授权,2021-10-29

[3] 崔成强、杨冠南、徐广东、张昱,一种嵌入式高散热扇出型封装结构及封装方法,ZL202010148008.8,授权,2022-02-11

[4] 崔成强、杨冠南、徐广东、张昱,一种高散热扇出型封装结构及封装方法,ZL202010148685.X,授权,2022-02-11

[5] 杨冠南、罗绍根、崔成强、张昱,一种抑制芯片漂移与翘曲的封装方法,ZL202010148690.0,授权,2022-02-22

[6] 杨冠南、吴润熹、崔成强、张昱,一种纳米金属辅助定向电镀及电解的线路成型与修复方法,ZL202110276041.3,授权,2022-05-17

[7] 杨冠南、李权震、崔成强、张昱,用于纳米金属膏定厚涂覆的涂覆设备及涂覆方法,ZL202110360601.3,授权,2022-05-20

[8] 杨冠南、李泽波、崔成强、张昱,一种常温成型的纳米导电金属膏与制备方法和应用,ZL202110375743.7,授权,2022-07-12

[9] 杨冠南、徐广东、崔成强、张昱、张凯,一种用于高低温容器的内置机械杠杆加载装置,ZL201910300424.2,授权,2021-09-03

[10] 杨冠南、张海德、崔成强、张昱,一种激光烧结成型方法,ZL202110486352.2,授权,2022-04-05

[11] 张昱、陈梓源、崔成强、杨冠南、张凯、高健、陈新,一种抗氧化微纳铜材料的制备方法,ZL201910399914.2,授权,2020-06-16

[12] 杨冠南、崔成强、吴润熹、李权震、张昱,一种基于纳米金属的线路修复装备,ZL202121127412.3,授权,2022-07-15

[13] 崔成强、徐广东、杨冠南、张昱、张凯、陈新,一种高密度线路嵌入转移的扇出型封装结构与方法,ZL201910446516.1,授权,2020-01-31

[14] 杨冠南、刘宇、黄钰森、崔成强、张昱,一种使用玻璃基板的系统级扇出型封装结构及其加工方法,ZL202110584785.1,授权,2022-05-17

[15] 杨冠南、赖海其、崔成强、张昱,一种静电场控制的芯片阵列扩张和巨量转移方法及其系统,ZL202110584785.1,授权,2022-08-02

[16] 杨冠南、钟朝彬、童金、崔成强、张昱,一种基于纳米金属冲击烧结的导电结构及其成型方法,ZL202110602170.7,授权,2022-06-03

[17] 杨冠南、曾宇杰、崔成强、张昱,一种纳米金属线路及结构的湿法激光成形方法,202110625035.4,授权,2022-12-16

[18] 孙斐、崔成强、杨冠南、赖海其、张昱,一种防静电抛光层、抛光垫及其制备方法和应用,ZL202110642340.4,授权,2022-10-28

[19] 杨冠南、崔成强、张昱,一种多层导电薄片三维结构成型方法,ZL202110654033.8,授权,2022-10-18

[20] 杨冠南、刘宇、崔成强、张昱,一种基于纳米金属的嵌入式三维互连结构制备方法,ZL202011638463.2,授权,2022-03-04

[21] 孙斐、杨冠南、刘宇、崔成强、张昱,一种基于纳米金属的深孔互连结构制备方法,ZL202011641344.2,授权,2022-04-19

[22] 杨冠南、李泽波、张昱、崔成强,一种双层叠电场引导的精细线路的定向修复方法,ZL202110662839.1,授权,2022-10-21

[23] 张昱;童金;崔成强;梁沛林;杨冠南,一种超细节距半导体互连结构及其成型方法,ZL202110661954.7,授权,2021-12-21

[24] 杨冠南、徐广东、崔成强,扇出型模块负压封装工艺、结构以及设备,ZL201910576050.7,授权,2021-05-11

[25] 杨冠南、徐广东、崔成强,扇出型模块高压封装工艺、结构以及设备,ZL201910577683.X,授权,2021-07-06

[26] 杨冠南、徐广东、匡自亮、崔成强,扇出型模块超声封装工艺、设备以及结构,ZL201910577684.4,授权,2021-03-16

[27] 杨冠南、姚可夫、李泽波、崔成强,载板填孔工艺的填充基材选型方法及载板填孔工艺,202110782313.7,授权,2022-12-30

[28] 杨冠南、何楚源、钟朝彬、崔成强、张昱,一种面向纳米金属膏体的点胶结构与点胶方法,ZL202110814636.X,授权,2022-07-19

[29] 杨冠南、吴润熹、崔成强、张昱,一种微小液滴辅助式纳米金属精细线路的加工方法,ZL202110856160.6,授权,2022-08-05

[30] 杨冠南、陈朗轩、崔成强、张昱,一种基于激光辅助溶解的三维空腔结构的成型方法,ZL202110856145.1,授权,2022-11-25

[31] 杨冠南、王鹏宇、陈梓源、徐广东、崔成强、张昱,一种微纳级核壳材料的制备方法和制备微纳级核壳材料的装置,ZL201910740479.5,授权,2021-07-02

[32] 陈新、杨冠南、崔成强、刘强,一种Micro-LED芯片的转移方法,ZL201911077056.6,授权,2020-04-27

[33] 崔成强、杨冠南、徐广东、张昱、陈新,一种用于精细线路的成型及修复方法,ZL201911229212.6,授权,2020-08-18

[34] 崔成强、杨冠南、徐广东、张昱、陈新,一种用于精细线路的修复方法,ZL201911229215.X,授权,2020-06-30

[35] 杨冠南、崔成强、陈新、刘强,一种用于Micro-LED巨量转移的可控分散方法及转移方法,ZL201811491491.9,授权,2019-09-24

[36] 崔成强、杨冠南、匡自亮、徐广东、王鹏宇、陈新,一种基于扇出型封装工艺的芯片封装方法及芯片封装结构,ZL201911379301.9,授权,2020-08-17

[37] 崔成强、杨冠南、赖海其、张昱,一种多级微纳混合金属膏及其制备方法,ZL202010105908.4,授权,2021-08-03

[38] 杨冠南、林伟、崔成强、张昱,单类和多类微小物体悬浮定向移动及自主装巨量转移方法,202010158051.2,授权,

[39] 杨冠南、林伟、崔成强、张昱,单类和多类微小物体漂浮定向移动及自主装巨量转移方法,202010158066.9,授权,

[40] 杨冠南、林伟、吴松、崔成强、张昱,一种基于滚筒的芯片扩张及巨量转移方法,202110425226.6,授权,2023-01-06

[41] 崔成强、杨冠南、赖海其、张昱,一种多级微纳混合金属膏及其制备方法,PCT-CN2021-075999PCT授权,2021-05-13

[42] 崔成强、杨冠南、徐广东、张昱、陈新,METHOD FOR REPAIRING A FINE LINEUS17110501,美国专利授权,2021-12-28

[43] 杨冠南、林伟、崔成强、张昱,单类和多类微小物体漂浮定向移动及自主装巨量转移方法,PCT-CN2021-075996PCT授权,2021-05-17

[44] 杨冠南、林伟、崔成强、张昱,单类和多类微小物体悬浮定向移动及自主装巨量转移方法,PCT-CN2021-075998PCT授权,2021-05-12

[45] 崔成强、杨冠南、张昱、徐广东、匡自亮、陈新,一种降低扇出型封装翘曲的方法,PCT-CN2019-112777PCT授权,2020-03-03

[46] 崔成强、徐广东、杨冠南、张昱、张凯、陈新,一种高密度线路嵌入转移的扇出型封装结构与方法,PCT-CN2020-092384PCT授权,2020-08-26

[47] 张昱、崔成强、曹萍、杨冠南,纳米导体或半导体材料尺寸可控的制备系统及制备方法,PCT-CN2020-138996PCT授权,2021-03-22

 

承担项目:

[1] 国家自然科学基金-青年基金, 62204063,面向玻璃转接板埋入式封装的微纳金属颗粒介观尺度互连机理研究,2023/012025/1230万元

[2] 广东省科技计划项目,2022A0505050071,应用于第三代半导体高功率器件的新型铜银双金属-石墨烯复合散热材料,20221-202312月,50

[3] 广东省区域联合基金-青年基金,2021A1515110656,基于纳米金属的精细线路激光修复成型技术及应用,2021-10-01 2024-09-3010

[4] 广东省自然科学基金项目-面上项目,2022A1515010141,面向高功率SiC半导体器件的新型微纳核壳双金属电子制造互连技术研究,202201-202412月,10

[5] 广州市科技计划项目,202201010322,基于纳米金属的新型电子制造盲孔/通孔填充技术开发及性能研究,2022/042023/035万元

[6] 广东工业大学省部共建精密电子制造技术与装备国家重点实验室自主项目,新型微纳核壳双金属填孔互连技术研究,2022.1-2023.1210

[7] 广东工业大学青年百人A配套科研经费,先进电子封装互连材料的开发及失效机理研究,2018/072023/0622041327120

[8] 广东工业大学青年教师培育计划项目,262511006,块体非晶合金剪切带分层与动态断裂机理研究,2019/012020/12, 10

 

参与项目:

[1] 中华人民共和国科学技术部,国家重点研发计划(战略性国际科技创新合作重点专项) 2018YFE0204600,用于先进封装互连的纳米铜材料和工艺研究及应用,2019/ 082022/07786

[2] 国家自然科学基金-面上项目,51571127,高饱和磁感强度铁基非晶合金的性能特征与影响机制研究,2016-01-012019-12-3195.8

[3] 国家自然科学基金-面上项目,51271095,循环载荷处理对非晶合金结构与性能的影响,2013.01-2016.1280

[4] 国家自然科学基金-面上项目, 62174039,面向超细节距半导体全铜封装的火花烧蚀低温低压瞬态互连机理研究,2022/012025/1260

[5] 广东省重点领域研发计划芯片、软件与计算(芯片类)重大专项项目,2021B0101290001,多类芯片异构集成先进封装技术研发与应用,2021/01-2023/121000

[6] 广东省重点领域研发计划,2020B0101290001,新型高频低损耗体声波滤波器关键材料与器件研发及应用,2019/ 012021/121500

[7] 广东省重点领域研发计划,2020B090922001,大功率蓝光半导体激光器与应用,2020/01-2022/121500

[8] 广东省自然科学基金面上项目,2021A1515011642,新型纳米铜基柔性印刷电子低温互连工艺研究,2021/012023/1210

[9] 广东工业大学省部共建精密电子制造技术与装备国家重点实验室自主项目,262531901,纳米铜的精细线路激光低温修复成型技术,2020-01-2021-12100

 

 

获得奖项:

广东工业大学专利挑战赛(2021年)一等奖

Excellent graduate student award, Chinese materials research society, 2017

ICEPT2020 Outstanding Poster AwardLuo S , Yang G , Xu G , et al. Effect of Power on the Hollow Phenomenon during Laser Sintering of Copper Nanoparticles

ICEPT2020 Best Student Paper AwardT. Lai, Y. Zhang, G. Yang, C. Cui, J. Leng, Highly strength Cu-Cu joint formation by sintering of copper nanomaterials

ICEPT2020 Outstanding Paper AwardB. Yang, C. Li, Z. Zhou, C.M. Ho, X. Hua, Y. Zhang, G. Yang, T. Lin, C. Cui, New Silver Alloy Bonding Wire Based on Environmentally Friendly Cathodic Passivation Protection and Its reliability

退火过程中非晶/纳米晶转变行为模拟,中国钢研集团2022年悬赏征算项目二等奖

金属粉末高温高压近净成形的致密化计算,中国钢研集团2022年悬赏征算项目优秀奖

太空电梯缆索材料设计,中国钢研集团2022年悬赏征算项目优秀奖

M@T teacher of Material Digital R&D, CISRI Group

广东工业大学2020-2021年、2021-2022年优秀班主任

广东工业大学2022年优秀创新成果奖

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