陈云

作者: 时间:2022-03-08 点击数:

   

                             



陈云,教授,博士生导师

省部共建精密电子制造技术与装备国家重点实验室

广东工业大学 机电工程学院 科研副院长

机械电子工程系第一党支部 书记

邮箱:chenyun@gdut.edu.cn


【简介】

主要从事先进电子封装工艺与装备、半导体湿法刻蚀加工技术与器件、激光加工技术与装备等方向研究。主持国家自然科学基金2项、中央军委装备预研领域基金1项、省部级项目5项,参与97302专项、国家自然科学基金重点项目等国家及省部级项目10余项。在Nano LettersSmallSmall methodsNano EnergyAdvanced materials等国际专业期刊上发表SCI论文50多篇(H index:15),影响因子大于1011篇;获美国发明专利授权8件、中国发明专利授权80多件。担任ACS Applied Materials & Interfaces20余种国际期刊审稿人。曾获高等学校科学研究优秀成果奖(科学技术)一等奖(2015)、广东省科技进步一等奖(2018)、机械工业联合会科技进步二等奖(2018)、湖南省优秀博士论文(2017)、香江学者年会最佳海报奖(2019)。入选2017年香江学者计划。


【教育背景与工作经历】

Ø  2019/11~至今,广东工业大学,机电工程学院,教授

Ø  2018/01~2019/11,广东工业大学,机电工程学院,副教授

Ø  2017/11~2019/11,香港中文大学,工学院,香江学者计划

Ø  2015/01~2017/12,广东工业大学,机电工程学院,讲师

Ø  2016/07~2017/07,美国佐治亚理工学院,访问学者

Ø  2013~2014,香港城市大学,系统工程与工程管理,研究助理

Ø  2009/09~2014/07,中南大学,机械工程,硕博连读

Ø  2005/09~2009/06,中南大学,机械设计制造及其自动化,本科


【科研项目】

(1)国家自然科学基金,第三代半导体纳米结构的电场/金属辅助湿法刻蚀加工新方法研究,519751272020/01-2023/1260万,主持

(2)国家自然科学基金,外力引导式化学刻蚀加工新方法制造皮升级微流体泵的基础研究,516051002017/01-2019/1220万,主持

(3)军委装备发展部领域基金,超高密度引线键合技术研究,JZX7Y201902630705012018/12-2020/1250万,主持

(4)国家“香江学者”计划,XJ2017050,实现硅在纳米级的均匀高纵横比金属辅助化学蚀刻,2017/11-2019/1130万人民币+30万港币,主持

(5)粤港澳联合创新领域项目,2020A0505140008,面向高通量制造半导体三维微纳结构的光诱导湿法刻蚀技术,2021/01-2022/12100万,主持

(6)广东省重大科技专项,2019B020231001,临床用新一代测序系统的研发及其在精准医学中的应用,2019/01-2021/1250万,课题负责人

(7)广东省公益能力项目,2016A010102016,面向高性能白光LED封装的高质量粉胶分配关键技术研究,2016/01-2018/1230万,主持

(8)广东省自然科学基金面上项目,微流体驱动的交替型刻蚀加工新方法制造折点纳米线阵列的基础研究,2017A0303133142017/05-2020/0410万,主持

(9)广州市科学研究专项,外力引导式化学刻蚀新方法加工复杂微结构阵列的基础研究,2017070104462017/05-2020/0420万,主持

(10)佛山南海区科技局重大科技项目,技术众包成果转移转化平台建设,2020/01-2021/1270万,主持

(11)中国工程院咨询研究项目,20ZK0274,广东省高端制造卡脖子问题研究,10万,参加

(12)中国工程院战略咨询项目,20210429165050,电子工业后端制造装备及其关键零部件卡脖子的关键基础和产业链的短板问题实证研究,2021/01-2021/1230万元,参加

(13)国家自然科学基金重大集成项目,U20A6004,高密度器件智能制造的基础科学问题研究,2021/01-2024/121578万,参加

(14)科技部973项目,2011CB013104,封装执行系统多参数耦合规律及复合运动生成,2012/01-2016/12500万,参加

(15)国家自然科学联合基金,U1601202,功能微结构阵列的新型加工理论与关键技术,2017/01-2020/12240万,核心骨干,排名第三

(16)广东省重大科技专项,2018B090906002,复杂构件表面激光精细制造工艺与装备,2019/01-2021/122200万元,核心骨干,排名第二

(17)广东省公益能力项目,2015B010104008,细间距芯片低温三维倒装互连关键技术研究与装备开发,2015/09-2018/09100万元,核心骨干,排名第三

(18)广东省自然科学基金重大基础培育项目,2016A030308016,集成电路三维封装中互连微通道形性协同的关键基础问题研究,2016/01-2020/12100万,核心骨干,排名第二

(19)广东省应用型科技研发专项资金项目,2015B010133005LED倒装与高密度芯片模组化精准封装核心装备研制及产业化,2015/09-2018/09500万元,核心骨干,排名第三

(20)广东省重大科技专项,2016B090905001,高密度超薄柔性封装基板研发与产业化,2016/01-2018/12500万,参加


【学术奖励】

(1)三维窄节距、大跨度互连封装的关键技术与应用,国家教育部,高等学校科学研究优秀成果奖(科学技术)一等奖,2015(排名5/11

(2)引线成形动力学过程实验与建模研究,湖南省优秀博士论文,2017(排名1

(3)面向点位操作的高速精密测量与定位关键技术及应用,中国机械工业科学技术进步二等奖,2018(排名9/10

(4)高端电子基板多品种高精高效制造核心装备、关键工艺及系统集成,广东省科技进步一等奖,2018(排名6/15

(5)Engineering the Nanowire Geometry by Metal Assisted Chemical Etching Method,香江学者年会最佳海报奖,2019(排名1/1

 

 

【代表性论文】

1)Yun Chen, Bin Xie, Junyu Long, Yicheng Kuang, Xin Chen*, Maoxiang Hou, Jian Gao, Shuang Zhou, Bi Fan, Yunbo He, Yuan-Ting Zhang, Ching-Ping Wong*, Zuankai Wang*, Ni Zhao*. Interfacial laser induced graphene enabling high performance liquid-solid triboelectric nanogenerator, Advanced Materials, 2021, 33, 2104290. (IF= 30.849, SCI 1, Top 期刊)

2)Yun Chen, Liyi Li, Cheng Zhang, Chia-Chi Tuan, Xin Chen*, Jian Gao, and Ching-Ping Wong*. Controlling Kink Geometry in Nanowires Fabricated by Alternating Metal-Assisted Chemical Etching. Nano Letters, 2017. 17(2): 1014–1019. (IF=13.779, SCI 1, Top 期刊)

3)Yun Chen, Cheng Zhang, Liyi Li, Chia-Chi Tuan, Fan Wu, Xin Chen*, Jian Gao, Yong Ding, and Ching-Ping Wong*, Fabricating and controlling silicon zigzag nanowires by diffusion-controlled metal-assisted chemical etching method. Nano Letters, 2017.17(7): 4304-4310. (IF=13.779, SCI 1, Top 期刊)

4)Yun Chen, Yicheng Kuang, Dachuang Shi, Maoxiang Hou, Xin Chen*, Lelun Jiang, Jian Gao, Lanyu Zhang, Yunbo He, Ching-Ping Wong*, A triboelectric nanogenerator design for harvesting environmental mechanical energy from water mist, Nano Energy, 2020, 73, 104765. (IF= 17.881, SCI 1, Top 期刊)

5)Yun Chen, Cheng Zhang, Liyi Li, Shuang Zhou, Xin Chen*, Jian Gao, Ni Zhao*, Ching-Ping Wong*, Hybrid Anodic and Metal-assisted Chemical Etching Method Enabling Fabrication of Silicon Carbide Nanowires, Small, 2019, 15(7), e1803898. (IF=13.281, SCI 1, Top 期刊)

6)Yun Chen, Junyu Long, Shuang Zhou, Dachuang Shi, Yan Huang, Xin Chen*, Jian Gao, Ni Zhao*, Ching-Ping Wong*, UV Laser-induced polyimide-to-graphene conversion: modeling, fabrication and application, Small Methods, 2019(3): 1900208. (IF=12.13, SCI 1)

7)Yun Chen, Junyu Long, Bin Xie,Yicheng Kuang, Xin Chen*, Maoxiang Hou, Jian Gao, Huilong Liu, Yunbo He, Ching-Ping Wong*, One-step UV laser-induced fluorine-doped graphene achieving super-hydrophobic properties and its application in deicing, ACS Applied Materials & Interfaces, 2022, 14, 3, 4647–4655. (IF= 9.229, SCI 1, Top 期刊)

8)Huilong Liu, Yixin Zheng, Kyoung-sik Moon, Yun Chen*, Dachuang Shi, Xin Chen*,Ching-Ping Wong*, Ambient-air in situ fabrication of high-surface-area, superhydrophilic, and microporous few-layer activated graphene films by ultrafast ultraviolet laser for enhanced energy storage, Nano Energy, 2022(94),106902 (IF= 17.881, SCI 1, Top 期刊)

9)Yun Chen, Yanhui Chen, Junyu Long, Dachuang Shi, Xin Chen, Maoxiang Hou, Jian Gao, Huilong Liu, Yunbo He, Bi Fan, Ching-Ping Wong and Ni Zhao. Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning. International Journal of Extreme Manufacturing, 2021, 3(3): 35104.(SCI)

10)Dachuang Shi, Yun Chen*, Xun Chen, Xin Chen, Jian Gao, Yunbo He, Chingping Wong*. Ladder-like tapered pillars enabling spontaneous and consecutive liquid transport. ACS Applied Materials & Interfaces, 2018, 10(40): 34735-34743. (IF= 9.229, SCI 1, Top 期刊)

11)Dachuang Shi#, Yun Chen#*, Yao Yao, Maoxiang Hou, Xin Chen, Jian Gao, Yunbo He, Guoping Zhang, Chingping Wong*. Ladderlike Conical Micropillars Facilitating Underwater Gas-Bubble Manipulation in an Aqueous Environment. ACS Applied Materials & Interfaces, 2020, 12(37): 42437-42445. (IF= 9.229, SCI 1, Top 期刊)

12)Yun Chen*, Han-xiong Li, Xiuyang Shan, Jian Gao, Xin Chen, Fuliang Wang. Ultrasound Aided Smooth Dispensing for High Viscoelastic Epoxy in Microelectronic Packaging. Ultrasonics Sonochemistry, 2016(28):15-20.(IF= 7.279, SCI 1)

13)Yun Chen, Dachuang Shi, Yanhui Chen, Xun Chen*, Jian Gao, Ni Zhao* and Ching-Ping Wong*, A facile, low-cost plasma etching method for achieving size controlled non-close-packed monolayer arrays of polystyrene nano-spheres, Nanomaterials, 2019, 9, 605. (IF= 5.076, SCI 2)

14)Yun Chen, Shuquan Ding, Junyu Long, Maoxiang Hou, Xin Chen, Jian Gao, Yunbo He, and Ching-Ping Wong, Rationally designing the trace of wire bonder head for large-span-ratio wire bonding in 3D stacked packaging, IEEE ACCESS, 2020, 8, 206571-206580. (IF= 4.098, SCI 2)

15)Maoxiang Hou, Neng Wang, Jianguo Ma, Yun Chen*, Xin Chen, Intensity modulated gas RI sensor based on inornate antiresonant hollow-core fiber with ultrahigh sensitivity. IEEE ACCESS, 2021, 9: 45270-45276. (IF= 4.098, SCI 2)

16)Yun Chen, Dachuang Shi, Xiquan Mai, Liyi Li, Jian Gao, Xin Chen*, Han-Xiong Li, Ching-Ping Wong*. Design and fabrication of inverted tapered micro-pillars for spontaneously transporting liquid upward. Microfluidics and Nanofluidics, 2018, 22(1):9.(IF=2.437, SCI 2)

17)Yun Chen, Cheng Zhang, Liyi Li, Chia-Chi Tuan, Xin Chen*, Jian Gao, Yunbo He, Ching-Ping Wong*, Effects of defects on the mechanical properties of kinked silicon nanowires, Nanoscale Research Letter, 2017, 12(1):185.(IF=3.159, SCI 2)

18)Yun Chen, Fuliang Wang, Han-xiong Li. Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5(7):1019-1026. (IF=1.86)

19)Yun Chen, Fuliang Wang. Comparison of Fundamental Frequency and Sweep Resistance of Different WireLoops Using Finite Element Model, International Journal of Structural Stability and Dynamics, 2015, 15(1):1450032. (IF=2.156)

20)Jian Wang, Shengzhu Yi, Zhilun Yang, Yun Chen*, Lelun Jiang*, Ching-Ping Wong, Laser Direct Structuring of Bioinspired Spine with Backward Micro-barbs and Hierarchical Microchannels for Ultrafast Water Transport and Efficient Fog Harvesting, ACS Applied Materials & Interfaces, 2020, 12(18):21080-21087. (IF=9.229, SCI 1, Top 期刊)

21)Maoxiang Hou, Neng Wang, Yun Chen*, Zhengping Ou, Xin Chen, Fangcheng Shen, Jiang, Haiming, Laser-induced graphene coated hollow-core fiber for humidity sensing. Sensors and Actuators B: Chemical, 2022:131530 (IF=7.460, SCI 1, Top 期刊).

22)Rui Shi, Junyu Long, Xinyu Zou, Guoyuan Fu, Li Yu, Yurun Tian, Yun Chen*, Fang Luo*, Porphyrin Functionalized Laser-Induced Graphene and Porous WO3 Assembled Effective Z-Scheme Photocatalyst for Enhanced Visible-Light-Driven Degradation of Ciprofloxacin, Catalysis Letters, 2021,DOI: 10.1007/s10562-021-03786-3 (IF=3.186, SCI 3)

23)Yan Huang, Yun Chen, Xiangyu Fan, Ningqi Luo, Shuang Zhou, Shih-Chi Chen, Ni Zhao*, Ching-Ping Wong*. Wood Derived Composites for High Sensitivity and Wide Linear-Range Pressure Sensing. Small, 2018, 14(31):1801520. (IF=13.281, SCI 1, Top 期刊)

24)Fuliang Wang, Yun Chen, Lei Han. Ultrasonic vibration at thermosonic flip-chip bonding interface, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011, 1(6):852-858. (IF=1.86)

25)Fuliang Wang, Yun Chen, Lei Han. Effect of capillary trace on dynamic loop profile evolution in thermosonic wire bonding, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(9):1550-1557. (IF=1.86)

26)Fuliang Wang, Yun Chen, Lei Han. Modeling of deep cavity looping process on 3-D stacked die package, IEEE Transactions on Semiconductor Manufacturing, 2013, 26(1):169-175. (IF= 1.336)

27)Fuliang Wang, Yun Chen, Lei Han. Investigation of complex looping process for thermosonic wire bonding, IEEE Transactions on Semiconductor Manufacturing, 2014, 27(2):238-245. (IF= 1.336)

28)Fuliang Wang, Yun Chen, Lei Han. Development of an Ultra long Ultralow n-Loop for Wire Bonding, IEEE Transactions on Semiconductor Manufacturing, 2015, 28(1):50-548. (IF= 1.336)

29)Fuliang Wang, Yun Chen, Lei Han. Modeling and experimental study of the kink formation process in wire bonding, IEEE Trans. Semiconductor Manufacturing, 2014, 27(1):51-59. (IF= 1.336)

30)Fuliang Wang, Yun Chen. Experimental and modeling studies of looping process for wire bonding, Journal of Electronic Packaging, 2013, 135(4):041009. (IF= 1.99)

31)Fuliang Wang, Yun Chen, Lei Han. Experiment study of dynamic looping process for thermosonic wire bonding, Microelectronics Reliability, 2012, 52(6):1105-1111. (IF= 1.483)

32)Fuliang Wang, Yun Chen. Modeling study of thermosonic flip chip bonding process, Microelectronics Reliability, 2012, 52(11):2749-2755. (IF= 1.483)

33)Xiuyang Shan, Yun Chen. Experimental and modeling study on viscosity of encapsulant for electronic packaging. Microelectronics Reliability, 2018, 80:42-46. (IF= 1.483)

34)Wu Dongqing, Gao Jian, Xiao Zhengtao, Zhang Lanyu, Chen Xin, Tang Hui, Yun Chen, He Yunbo, Triangular Model Registration Algorithm through Differential Topological Singularity Points by Helmholtz-Hodge Decomposition. IEEE Access.2019, 7:34776-34790. (IF= 4.098)

35)He Yunbo, Mai Xiquan, Cui Cchengqiang, Gao Jian, Yang Zhijun, Zhang Kai, Chen Xun, Chen Yun, Tang Hui, Dynamic Modeling, Simulation, and Experimental Verification of a Wafer Handling SCARA Robot with Decoupling Servo Control. IEEE Access, 2019, 7:47143-47153. (IF= 4.098)

36)Qing Mei, Jian Gao, Hui Lin, Yun Chen, He Yunbo, Wei Wang, Guanjin Zhang, Xin Chen, Structure light telecentric stereoscopic vision 3D measurement system based on Scheimpflug condition. Optics and Lasers in Engineering, 2016, 86:83-91. (IF= 4.059)

37)Mingliang Wang, Han-Xiong Li, Xin Chen, Yun Chen. Deep Learning-Based Model Reduction for Distributed Parameter Systems. IEEE Transactions on Systems, Man, and Cybernetics: Systems, 2016, 46(12):1664-1674. (IF= 7.351)

38)Xinxiu Wu, Fangfang Niu, Ao Zhong, Fei Han, Yun Chen, Jinhui Li*, Guoping Zhang*, Rong Sun, Ching-Ping Wong, Highly sensitive strain sensors based on hollow packaged silver nanoparticle-decorated three-dimensional graphene foams for wearable electronics, RSC Advances, 2019, 9:39958-39964. (IF= 3.119)

39)Liyi Li, Cheng Zhang, Chia-Chi Tuan, Yun Chen, Ching Ping Wong. High-Aspect-Ratio Microstructures with Versatile Slanting Angles on Silicon by Uniform Metal-assisted Chemical Etching. Journal of Micromechanics and Microengineering, 2018, 22:055006. (IF= 2.141)

40)Liyi Li, Chia-Chi Tuan, Cheng Zhang, Yun Chen, Gan Lian, Ching Ping Wong. Uniform Metal-Assisted Chemical Etching for Ultra-High-Aspect-Ratio Microstructures on Silicon. Journal of Microelectromechanical Systems.2018, 1-11. (IF= 2.621)

41)Xiuyang Shan, Han-Xiong Li, Haitao Si, Yun Chen. Integrated Sensing-/Model-Based Online Estimation of Jet Dispensing. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(2):300-309. (IF=1.86).

42)Chia-Chi Tuan, Nathan Pataki James, Ziyin Lin, Yun Chen, Yan Liu, Kyoung-Sik Moon, Zhuo Li, Ching-Ping Wong*, Self-patterning of Silica/Epoxy Nanocomposite Underfill by Tailored Hydrophilic-Superhydrophobic Surfaces for 3D Integrated Circuit (IC) Stacking, ACS Applied Materials & Interfaces, 2017, 9(10), 8437-8442. (IF=8.758, SCI 1, Top 期刊)

43)Lanyu Zhang, Jian Gao, Xin Chen, Hui Tang, Yun Chen, Yunbo He, and Zhijun Yang, A Rapid Vibration Reduction Method for Macro–Micro Composite Precision Positioning Stage. IEEE Transactions on Industrial Electronics, 2017. 64(1): 401-411. (IF =7.503, Top期刊)

44)Yuanyuan Li, Zhipeng Chen, Guizhou Zheng, Wenhao Zhong, Liyuan Jiang, Yawen Yang, Lelun Jiang*, Yun Chen, Ching-Ping Wong, A Magnetized Microneedle-Array Based Flexible Triboelectric-Electromagnetic Hybrid Generator for Human Motion Monitoring, Nano Energy, 2020, 69:104415. (IF=16.602, SCI 1, Top 期刊)

45)Huilong Liu, Yingxi Xie, Jiaxiong Li, Zhijian Sun, Junbo Liu, Kyoung-sik Moon, Longsheng Lu, Yun Chen, Yong Tang, Xin Chen, Ching-Ping Wong. Laser-induced nitrogen-self-doped graphite nanofibers from cyanate ester for on-chip micro-supercapacitors. Chemical Engineering Journal, 2021, 404:126375. (IF=10.652, SCI 1, Top期刊)

46)Lanyu Zhang, Jian Gao*, Yunbo He, Xin Chen, Yun Chen, Hui Tang, Zhijun Yang. A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process, IEEE Transactions on Industrial Electronics, 2021, 68(8):7252-7262. (IF =7.503, Top期刊)

47)Lanyu Zhang, Jian Gao*, Xin Chen, Yun Chen, Yunbo He, Yu Zhang, Hui Tang, Zhijun Yang. Implementation and Experiment of an Active Vibration Reduction Strategy for Macro-Micro Positioning System, Precision Engineering, 2018, 51:319~330

48)Jian Gao*, HaoWen, Haidong Wu, Zhiyuan Lin, Si Li, Yun Chen, Yunbo He, Geometric Model Reconstruction through a Surface Extension Algorithm for Repair of Twist Blades, Rapid Prototyping Journal, 2017, 2(23): 382-390.

 

【代表性授权发明专利】

1)Yun Chen, Long Junyu, Shuang Zhou, Xin Chen, Jian Gao, Qiang Liu, Chingping Wong, Shenghui Zhang. Method and Device for Processing Microstructure Arrays of Polystyrene-Graphene Nanocomposites, 2020/12/01, US10,850,304B2(美国

2)Yun Chen, Shuquan Ding, Yunbo He, Maoxiang Hou, Xin Chen, Jian Gao, Ni Zhao, Lanyu Zhang, Zhengping Wang, Method for processing an ultra-high density space interconnect lead under light source guidance, 2021/12/28, US11,211,357B2(美国

3)Yun Chen, Dachuang Shi, Xin Chen, Qiang Liu, Jian Gao, Ching-Ping Wong, Mass Transfer Method for Micro-Leds With a Temperature controlled Adhesive Layer, 2020/09/22, US10,784,400B2(美国)

4)Yun Chen, Xin Chen, Dachuang Shi, Xun Chen, Qiang Liu, Jian Gao, Chengqiang Cui. Method for Synchronous Electroplating Filling of Differential Vias and Electroplating Device, 2019/11/26, US10,487,411B1(美国)

5)Yun Chen, Xin Chen, Dachuang Shi, Jian Gao, Zhengping Wang, Haidong Yang, Method of Processing Nano-and Micro-Pores, 2019/10/01, US10,427,936B2(美国)

6)Xin Chen, Yun Chen, Dachuang Shi, Xun Chen, Qiang Liu, Jian Gao, Chengqiang Cui, Method for Synchronous Wet Etching Processing of Differential Microstructures, 2019/11/05, US10,468,265B1(美国

7)陈云、施达创、陈新、等,一种温控粘附式Micro-LED巨量转移方法,2020/02/01PCT/CN2019/113339(PCT)

8)陈云、陈燕辉、丁树权、龙俊宇、肖嘉薇、陈桪、陈新、高健,一种超高导热和高韧性器件的加工方法,2022/03/01ZL202011555129.0

9)陈云、郑埸鑫、李梓健、谢斌、丁树权、贺梓霖、等,一种电致图案化石墨烯电极的制备方法及其装置,2022/02/14ZL202111003359.0

10)陈云、丁树权、高增光、肖嘉薇、吴然皓、陈新、陈桪、高健,一种石墨烯导热膜的制备方法和生产线,2021/09/14ZL202011554657.4

11)陈云、肖嘉薇、丁树权、高增光、林灿光、龙俊宇、陈桪、陈新、高健,一种氟化石墨烯的温和放电制备方法和装置,2021/08/31ZL202011554679.0

12)陈云、吴然皓、丁树权、罗翔远、肖嘉薇、陈桪、陈新、高健,一种高压混合放电的石墨烯生产方法和装置,2021/08/24ZL202011554659.3

13)陈云、董善坤、丁树权、施达创、侯茂祥、陈新、高健,一种金属辅助化学刻蚀离散型硅纳米孔图案的方法及装置,2021/8/24ZL202011415540.8

14)陈云、丁树权、侯胜禹、贺梓霖、吴然皓、陈桪、陈新、高健,一种高质高效、绿色节能的石墨烯生产方法和装置,2021/08/03ZL202011554693.0

15)陈云、贺梓霖、丁树权、吴然皓、侯胜禹、龙俊宇、陈桪、陈新、高健一种电冲击法生产石墨烯的装置及方法,2021/08/03ZL202011556101.9

16)陈云、侯胜禹、丁树权、吴保茂、贺梓霖、陈新、陈桪、高健,一种制备石墨烯粉末的装置及方法,2021/08/10ZL202011556293.3

17)陈云、卜弋轩、郭媛慧、丁树权、吴然皓、陈新、陈桪、高健,一种热屏蔽组件的加工方法及其装置,2021/08/10ZL202011556349.5

18)陈云、郭媛慧、卜弋轩、丁树权、侯胜禹、龙俊宇、陈桪、陈新、高健,一种具有热操纵功能石墨烯薄膜的加工装置及方法,2021/07/27ZL202011554757.7

19)陈云、郭媛慧、卜弋轩、林灿光、高增光、龙俊宇、陈桪、陈新、高健一种具有微型热结构图案的石墨烯薄膜的加工系统及方法,2021/07/27ZL202011554759.6

20)陈云、贺梓霖、丁树权、高增光、罗翔远、陈新、陈桪、健一种电冲击批量化生产石墨烯的放电电极装置及方法,2021/06/16ZL202011554795.2

21)陈云、罗翔远、丁树权、林灿光、高增光、陈新、陈桪、高健,石墨烯基聚乙二醇相变材料的制备方法和装置,2021/06/03ZL202011556014.3

22)陈云、贺梓霖、丁树权、高增光、罗翔远、陈新、陈桪、高健一种电冲击批量化生产石墨烯的放电电极装置及方法,2021/06/16ZL202011554795.2

23)陈云、丁树权、侯茂祥、陈新、高健、刘强、贺云波,一种基于相位掩膜干涉的Micro-LED巨量转移装置和方法,2021/1/12ZL202010485734.9

24)陈云、丁树权、陈新、高健、刘强、贺云波,一种柔性可拉伸的Micro-LED巨量转移装置和方法,2020/11/24ZL202010485732.X

25)陈云、陈燕辉、丁树权、施达创、陈新、高健、刘强,一种基于光学操控的纳米孔阵列的可控加工方法及装置,2020/09/29ZL202010192100.4

26)陈云、丁树权、陈新、高健、赵铌、侯茂祥、等,一种形状可控的3D螺旋微天线的加工方法及装置,2020/8/11ZL202010018770.4

27)陈云、丁树权、贺云波、侯茂祥、陈新、高健、等,一种光源引导下的超高密度空间互连引线的加工方法,2020/08/04ZL202010018794.X

28)陈云、邝祎程、卜弋轩、侯茂祥、陈新、高健、刘强、等,一种收集水雾产生电能的摩擦纳米发电机及其制备方法,2020/07/28ZL201911039516.6

29)陈云、施达创、姚瑶、侯茂祥、陈新、高健、等,一种在水下实现连续传输气泡的仿生结构及其加工方法,2020/07/14ZL201911039516.6

30)陈云、姚瑶、丁树权、龙俊宇、侯茂祥、施达创、陈新、高健、等,一种芯片内部电路断路缺陷的修复方法及装置,2020/07/07ZL201911206961.7

31)陈云、陈新、施达创、高健、等,一种改善孔锥度的激光打孔装置及方法,2020/05/26ZL201610350992.X

32)陈云、丁树权、贺云波、陈新、刘强、高健、等,一种三维快速引线成弧方法及装置,2020/03/13ZL201910791507.6

33)陈云、龙俊宇、周双、陈新、高健、刘强、等,一种通过紫外激光快速制备图案化掺杂石墨烯的方法,2019/09/07ZL201910054331.6

34)陈云、龙俊宇、周双、陈新、高健、刘强、等,加工聚苯乙烯、石墨烯纳米复合微结构阵列的方法与装置,2019/08/13ZL201910054318.0

35)陈云、龙俊宇、李力一、陈新、高健、刘强、等,一种通过激光加工顶接触结构有机场效应晶体管的方法,2019/08/01ZL201910055206.7

36)陈云、丁树权、李力一、陈新、高健、刘强、等,一种利用紫外激光加工干法刻蚀中硬掩膜板的方法,2019/09/04ZL201910054320.8

37)陈云、施达创、陈新、刘强、高健、等,一种温控粘附式Micro-LED巨量转移方法2019/08/13,ZL201811564858.5

38)陈云、邝祎程、陈新、刘强、高健、等,一种Micro-LED的转移方法,2019/07/26ZL201811577696.9

39)陈云、施达创、陈新、刘强、高健、等,一种采用超声驻波操纵Micro-LED巨量转移的方法,2019/07/30ZL201811564866.X

40)陈云、施达创、陈新、刘强、高健、等一种超声释放式Micro-LED巨量转移方法2019/10/8,ZL201811564324.2

41)陈云、苏振欣、施达创、麦锡全、陈新、高健、等,一种高粘度胶液喷射点胶质量提升方法及点胶装置,2019/04/12ZL201611094570.7

42)陈云、施达创、陈新、陈桪、刘强、高健,一种长距离自发定向传输液滴的仿生结构及其加工方法,2019/02/26ZL201810338026.5

43)陈云、麦锡全、陈新、高健、等,一种微纳孔阵列的加工装置,2019/2/22ZL201711352929.0

44)陈云、陈新、麦锡全、高健、等,一种面向第三代半导体材料的加工装置,2018/10/12ZL201711351566.9

45)陈云、陈新、麦锡全、刘强、高健、高波,金属折点纳米线阵列的制备方法及其金属折点纳米线阵列,2018/08/21ZL201710641229.7

46)陈云、陈新、麦锡全、刘强、高健、高波,一种具有极小孔径的阶梯孔阵列的加工方法,2018/06/05ZL201710642230.1

47)陈云、陈新、刘强、高健、高波,直径可变的金属折点纳米线阵列的制备方法及其线阵列,2018/03/16ZL201710641230.X

48)陈云、李力一、苏振欣、陈新、刘强、,一种微结构刻蚀的加工装置,2018/1/12,ZL201710019563.9

49)陈云、李力一、苏振欣、陈新、刘强、,一种完全可控弯曲角的折点纳米线阵列的制备方法,2017/11/07,ZL201710028040.0

50)陈云、李力一、苏振欣、陈新、刘强、,一种任意三维微结构的加工方法,2017/11/07,ZL201710019539.5

51)陈云、高健、陈新、贺云波、杨志军、乔家平,一种阻尼装置中阻尼力的智能调整方法, 2017/06/09ZL201510611895.7

52)陈云、陈新、施达创、高健、等,一种通过液体散射改善通孔锥度的装置及方法,2017/05/03ZL201610350918.8

53)陈云、陈新、高健、贺云波、杨志军、乔家平,一种阻尼力智能可调的阻尼装置,2017/03/29ZL201510613279.5

54)陈云、陈新、高健、张昱、等,一种复杂三维结构微通道的加工方法,2017/03/08,ZL201610034243.6

55)高增光(本人学生)、陈云、贺梓霖、罗翔远、吴然皓、等,碳化硅/石墨烯复合材料负载铂原子催化剂的制备方法,2022/02/23ZL202111003334.0

56)罗翔远(本人学生)、陈云、贺梓霖、吴然皓、肖嘉薇、高增光、谢斌、等,一种石墨烯基高熵合金材料的制备方法,2022/02/11ZL202111003309.2

57)施达创(本人学生)、陈云、麦锡全、苏振欣、陈新,一种利用激光光束打孔的装置和方法,2018/3/27ZL201610601134.8

58)麦锡全(本人学生)、陈云、施达创、陈新、高健、贺云波,一种基于激光可控弯折角的弯折微孔加工方法,2019/10/10,ZL201810500911.9

59)丁树权(本人学生)、陈云、陈新、高健、贺云波、等,一种可控的可拉伸双螺旋微导线的加工方法及其装置,2020/09/15ZL202010019414.4

60)丁树权(本人学生)、陈云、王晗、陈新、侯茂祥、高健、刘强,用于Micro-LED巨量转移的仿生抓取装置及使用、制造方法,2020/09/29ZL202010192097.6

61)陈新、陈云、刘辉龙、丁树权、崔成强、刘强,一种结合模具压印与固化工艺加工印制电路板的方法,ZL202011389322.1,2021/08/10

62)陈新、陈云、施达创、崔成强、侯茂祥、汤晖、高健、刘强、贺云波、陈新度、杨志军,一种Micro-LED巨量转移方法及转移装置,2020/11/10ZL202010302164.5

63)陈新、陈云、施达创、陈桪、刘强、高健、崔成强,一种差异化孔同步电镀填充的方法和电镀装置,2019/03/19ZL201810339287.9

64)陈新、陈云、施达创、陈桪、刘强、高健、崔成强,一种差异化微结构的同步湿法刻蚀加工方法,2019/02/26ZL201810338811.0

65)陈新、施达创、陈云、高健、等,一种纳米及微米孔的加工方法,2018/11/06ZL201711349542.X

66)侯茂祥、汪能、陈云、丁树权、龙俊宇、陈新、高健、张揽宇,一种带石墨烯涂层的长周期光纤光栅制备方法及装置,2020/08/25ZL202010092783.6

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